Semiconductor device and manufacturing method therefor

ABSTRACT

The present disclosure relates to the technical field of semiconductors, and discloses a semiconductor device and a manufacturing method therefor. The method includes: providing a substrate structure, where the substrate structure includes: a substrate having a first device region and a second device region, a first dummy gate structure at the first device region, a second dummy gate structure at the second device region, and an LDD region below the first dummy gate structure. The first dummy gate structure includes a first dummy gate dielectric layer at the first device region, a first dummy gate on the first dummy gate dielectric layer, and a first spacer layer at a side wall of the first dummy gate. The second dummy gate structure includes a second dummy gate dielectric layer at the second device region, a second dummy gate on the second dummy gate dielectric layer, and a second spacer layer at a side wall of the second dummy gate. The method further includes removing the first dummy gate; etching back the first spacer layer to reduce a thickness of the first spacer layer; removing an exposed portion of the first dummy gate dielectric layer to form a first trench; and removing the second dummy gate and exposed second dummy gate dielectric layer to form a second trench.

RELATED APPLICATION

The present application claims priority to Chinese Patent Appln. No.201611046396.9, filed Nov. 23, 2016, the entirety of which is herebyincorporated by reference.

BACKGROUND Technical Field

The present disclosure relates to a technical field of semiconductors,and more particularly to a semiconductor device and a manufacturingmethod therefor.

Related Art

With a critical dimension of a metal oxide semiconductor field effecttransistor (Metal Oxide Semiconductor Field Effect Transistor, MOSFET)decreasing, Short Channel Effect (Short Channel Effect, SCE) becomes acritical factor that affects device performances. A Fin Field EffectTransistor (Fin Field Effect Transistor, FinFET) has a better gatecontrol ability, and can effectively suppress the short channel effect.Therefore, often a FinFET device is used in designing a semiconductorelement of a smaller dimension.

Regarding a System-On-a-Chip (System-On-a-Chip, SOC), different types ofdevices may need to be manufactured at the same time. For example, aninput/output (I/O) device and a core device may need to be manufacturedat the same time. To control a short channel effect of a core device, asmaller thermal budget is required. However, a smaller thermal budgetresults in an overlapping area of a Lightly Doped Drain (LDD) region anda channel region of the I/O device being smaller, thereby reducing areliability of the I/O device. Other devices that are manufactured atthe same time may experience the same problems.

SUMMARY

An object of the present disclosure is improving device reliability. Inone form of the present disclosure, a method for manufacturing asemiconductor device is provided. The method includes providing asubstrate structure, where the substrate structure includes: a substratehaving a first device region and a second device region, a first dummygate structure at the first device region, a second dummy gate structureat the second device region, and a Lightly Doped Drain (LDD) regionbelow the first dummy gate structure. The first dummy gate structureincludes a first dummy gate dielectric layer at the first device region,a first dummy gate on the first dummy gate dielectric layer, and a firstspacer layer at a side wall of the first dummy gate. The second dummygate structure including a second dummy gate dielectric layer at thesecond device region, a second dummy gate on the second dummy gatedielectric layer, and a second spacer layer at a side wall of the seconddummy gate. The method further includes removing the first dummy gate;etching back the first spacer layer to reduce a thickness of the firstspacer layer; removing an exposed portion of the first dummy gatedielectric layer to form a first trench, and removing the second dummygate and exposed second dummy gate dielectric layer to form a secondtrench.

In some implementations, the method further includes: depositing a gatedielectric layer to cover a bottom portion and a side wall of the firsttrench and a bottom portion and a side wall of the second trench; anddepositing a gate material on the gate dielectric layer.

In some implementations, the method further includes: before depositinga gate dielectric layer, forming an interface layer at the bottomportion of the first trench and the bottom portion of the second trench.

In some implementations, the method further includes: before depositinga gate dielectric layer, forming a gate oxide layer at the bottomportion of the first trench.

In some implementations, the first device region includes an I/O deviceregion, and the second device region includes a core device region.

In some implementations, the first device region includes a firstsemiconductor region and a first semiconductor fin at the firstsemiconductor region; and the second device region includes a secondsemiconductor region and a second semiconductor fin at the secondsemiconductor region, where the first dummy gate structure spans overthe first semiconductor fin and the second dummy gate structure spansover the second semiconductor fin.

In some implementations, providing a substrate structure may include:providing an initial the substrate; etching the initial substrate toform the first device region and the second device region; forming anisolation region between various semiconductor fins, where a top surfaceof the isolation region is lower than a top surface of eachsemiconductor fin; forming dummy gate dielectric layers at surfaces ofportions of the various semiconductor fins that are located above theisolation region; depositing a dummy gate material and patterning thedummy gate material to form the first dummy gate and the second dummygate; forming the first spacer layer at side walls of the first dummygate and the first dummy gate dielectric layer, and forming the secondspacer layer at side walls of the second dummy gate and the second dummygate dielectric layer; performing LDD injection using the first spacerlayer as a mask to form the LDD region to form a first structure;depositing an inter layer dielectric layer on the first structure; andplanarizing the interlayer dielectric layer to expose the first dummygate and the second dummy gate.

In some implementations, depositing an interlayer dielectric layer onthe first structure may include: depositing a contact etch stop layer onthe first structure; and depositing the interlayer dielectric layer onthe contact etch stop layer.

In another form of the present disclosure, a semiconductor device isprovided, including: a substrate having a first device region and asecond device region; a first trench at the first device region; a firstspacer layer at a side wall of the first trench; an LDD region below thefirst trench; a second trench at the second device region; and a secondspacer layer at a side wall of the second trench, where a thickness ofthe first spacer layer is smaller than a thickness of the second spacerlayer.

In some implementations, the device further includes a first gatestructure and a second gate structure, where the first gate structureincludes a first gate dielectric layer at a bottom portion and a sidewall of the first trench, and a first gate electrode on the first gatedielectric layer; and the second gate structure includes a second gatedielectric layer at a bottom portion and a side wall of the secondtrench, and a second gate electrode on the second gate dielectric layer.

In some implementations, the first device region includes a firstsemiconductor region and a first semiconductor fin at the firstsemiconductor region; and the second device region includes a secondsemiconductor region and a second semiconductor fin at the secondsemiconductor region, where the first gate structure spans over thefirst semiconductor fin, and the second gate structure spans over thesecond semiconductor fin.

In some implementations, the device further includes: an interface layerbetween the bottom portion of the first trench and the first gatedielectric layer, and between the bottom portion of the second trenchand the second gate dielectric layer.

In some implementations, the first gate structure further includes agate oxide layer between the bottom portion of the first trench and thefirst gate dielectric layer.

In some implementations, the first device region includes an I/O deviceregion, and the second device region includes a core device region.

In yet another form of the present disclosure, a method formanufacturing a semiconductor device is provided, including: providing asubstrate structure, where the substrate structure includes: asubstrate, a dummy gate structure on the substrate; and a Lightly DopedDrain (LDD) region below the dummy gate structure. The dummy gatestructure includes a dummy gate dielectric layer on the substrate, adummy gate on the dummy gate dielectric layer, and a spacer layer at aside wall of the dummy gate. The method further includes removing thedummy gate; etching back the spacer layer, so as to reduce thickness ofthe spacer layer; and removing exposed dummy gate dielectric layer, soas to from a trench.

In implementations of methods for manufacturing a semiconductor deviceprovided by the present disclosure, a first dummy gate is first removed.Then a thickness of a first spacer layer is reduced by etching it back,and then, a second dummy gate and exposed second dummy gate dielectriclayer are removed. Compared with simultaneously removing the first dummygate and the second dummy gate as in the prior art, implementations ofmethods of the present disclosure, in a case in which thermal budget isnot added, may increase an overlapping area of a channel region and anLDD region of a first device after a gate electrode is subsequentlyformed, so as to improve reliability of the device.

In light of the following detailed descriptions of embodiments andimplementations of the present disclosure for illustration purposes withreference to the accompanying drawings, other characters, aspects, andadvantages of the present invention become clear.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings form a part of the specification, assist indescribing embodiments and implementations of the present disclosure forillustration purposes, and are used to explain the principles of thepresent disclosure together with the specification. In the accompanyingdrawings:

FIG. 1 is a simplified flowchart of a method for manufacturing asemiconductor device;

FIG. 2 to FIG. 6 show schematic sectional diagrams of various phases ofa method for manufacturing a semiconductor device;

FIG. 7 to FIG. 9 show schematic sectional diagrams of various phases ofanother method for manufacturing a semiconductor device;

FIG. 10A to FIG. 10J show schematic sectional diagrams of various phasesfor forming a substrate structure shown in FIG. 2; and

FIG. 11 is a simplified flowchart of a method for manufacturing asemiconductor device.

DETAILED DESCRIPTION

Embodiments and implementations of the present disclosure are describedin detail for illustration purposes with reference to the accompanyingdrawings. It should be noted that unless being described in detail,relative layouts, mathematical expressions, and numeric values ofcomponents and steps described in these embodiments and implementationsshould not be understood as a limitation to the scope of the presentdisclosure.

In addition, it should be understood that for ease of description, sizesof the parts shown in the accompanying drawings are not necessarilydrawn according to an actual proportional relationship. For example,thicknesses or widths of some layers may be magnified with respect toother layers.

The following description about the embodiments and implementations ofthe present disclosure are presented for illustration purposes only, andshould not be used as a limitation on the present disclosure andapplications or uses of the present disclosure in any sense.

Technologies, methods, and devices that are known by a person ofordinary skill in the related fields may not be discussed in detail.However, in cases in which the technologies, methods, and devices areapplicable, the technologies, methods, and devices should be consideredas a part of the description.

It should be noted that similar reference signs and letters are used torepresent similar items in the following accompanying drawings.Therefore, once an item is defined or described in a figure, the itemneeds not to be further discussed in the description of the subsequentfigures.

Regarding the foregoing problem, the inventor has found that to increasean overlapping area of an LDD region and a channel region, dose ofinjecting the LDD may be increased. However, after the dose of injectingthe LDD is increased, a reliability of some devices such as an I/Odevice may decrease. On this basis, the inventor provides the followingsolutions to address this problem.

FIG. 1 is a simplified flowchart of a method for manufacturing asemiconductor device. As shown in FIG. 1, in step 102, a substratestructure is provided.

FIG. 2 shows a schematic sectional diagram of one implementation of asubstrate structure. As shown in FIG. 2, the substrate structureincludes: a substrate having a first device region 201 and a seconddevice region 202, a first dummy gate structure 203 at the first deviceregion 201, a second dummy gate structure 204 at the second deviceregion 202 and a Lightly Doped Drain (LDD) region 205 in the substratebelow the first dummy gate structure 203. The LDD region 205 facilitatesto reduce Hot Carrier Effect (Hot Carrier Effect, HCE). It should beunderstood that the substrate below the second dummy gate structure 204may also be provided with an LDD region. In some implementations, thefirst device region 201, for example, may include an input/output (I/O)device region, and the second device region, for example, may include acore device region. The first device region 201 and the second deviceregion 202 may be separated by using an isolation region 206, such as ashallow trench isolation (STI) region. In addition, the substratestructure may further include a raised first source/drain region 207 attwo sides of the first dummy gate structure 203 and a secondsource/drain region 208 at two sides of the second dummy gate structure204. In addition, an interlayer dielectric (ILD) layer 209 may beprovided above the isolation region 206.

As shown in FIG. 2, the first dummy gate structure 203 includes a firstdummy gate dielectric layer 213 (such as an oxide of silicon) at thefirst device region 201, a first dummy gate 223 (such as polysilicon) onthe first dummy gate dielectric layer 213, and a first spacer layer 233(such as a nitride of silicon) at a side wall of the first dummy gate223. The second dummy gate structure 204 includes a second dummy gatedielectric layer 214 (such as an oxide of silicon) at the second deviceregion 202, a second dummy gate 224 (such as polysilicon) on the seconddummy gate dielectric layer 214, and a second spacer layer 234 (such asa nitride of silicon) at a side wall of the second dummy gate 224. Itshould be understood that the first spacer layer 233 may also be on thefirst dummy gate dielectric layer 213, and the second spacer layer 234may also be on the second dummy gate dielectric layer 214.

In some implementations, as shown in FIG. 2, the first device region 201may include a first semiconductor region 211 and a first semiconductorfin 221 at the first semiconductor region 211, and the second deviceregion 202 may include a second semiconductor region 212 and a secondsemiconductor fin 222 at the second semiconductor region 212. In such acase, the first dummy gate structure 203 may span over the firstsemiconductor fin 221 and the second dummy gate structure 204 may spanover the second semiconductor fin 222. It should be noted that in thepresent context, the term “span” is understood as the following: forexample, the first dummy gate structure spans over the firstsemiconductor fin refers to that an upper surface and a side wall of aportion above the first semiconductor fin are both formed with the firstdummy gate structure, and the first dummy gate structure is furtherformed at a part of the surface of the first semiconductor region.

Subsequently, in step 104, the first dummy gate 223 is removed. Forexample, the first dummy gate 223 may be removed using dry etching toexpose the first spacer layer 233, as shown in FIG. 3.

Subsequently, in step 106, the first spacer layer 233 is etched back toreduce a thickness of the first spacer layer 233, as shown in FIG. 4.

Subsequently, in step 108, the exposed first dummy gate dielectric layer213 is removed to form a first trench 501, as shown in FIG. 5. It shouldbe understood that when removing the exposed first dummy gate dielectriclayer 213, a part of the first dummy gate dielectric layer 213 which islocated below the first spacer layer 233 may also be removed. Forexample, a width of the first spacer layer 233 (width along a directionof a channel) may be about 50-80 angstroms, and a width of the firstdummy gate dielectric layer 213 (width along a direction of a channel)below the first spacer layer 233 may be about 30 angstroms.

Subsequently, in step 110, the second dummy gate 224 and the exposedsecond dummy gate dielectric layer 214 are removed to form a secondtrench 601, as shown in FIG. 6. Similar to the above, in someimplementations, when removing the exposed second dummy gate dielectriclayer 214, a part of the second dummy gate dielectric layer 214 which islocated below the second spacer layer 234 may also be removed.

One method for manufacturing a semiconductor device is described above.In the described method, a first dummy gate is removed, then a thicknessof a first spacer layer is reduced by etching it back, and then a seconddummy gate and an exposed second dummy gate dielectric layer areremoved. Compared with simultaneously removing the first dummy gate andthe second dummy gate in the prior art, the method of thisimplementation, in a case in which thermal budget is not added, mayincrease an overlapping area of a channel region and an LDD region of afirst device after a gate electrode is subsequently formed, so as toimprove reliability of the device.

Corresponding to the foregoing method, the present disclosure provides asemiconductor device. With reference to FIG. 6, the semiconductor devicemay include: a substrate having a first device region 201 and a seconddevice region 202; a first trench 501 at the first device region 201; afirst spacer layer 233 at a side wall of the first trench 501; an LDDregion 205 below the first trench; a second trench 601 at the seconddevice region 202; and a second spacer layer 234 at a side wall of thesecond trench 601. Herein, a thickness of the first spacer layer 233 issmaller than a thickness of the second spacer layer 234.

For example, the first device region 201 may be an I/O device region,and the second device region 202 may be a core device region. In oneimplementation, with reference to FIG. 6, the first device region 201may include a first semiconductor region 211 and a first semiconductorfin 221 at the first semiconductor region 211; and the second deviceregion 202 may include a second semiconductor region 212 and a secondsemiconductor fin 222 at the second semiconductor region 212.

In some embodiments, after the first trench 501 and the second trench601 shown in FIG. 6 are formed, the foregoing manufacturing method mayfurther include the following steps:

Depositing a gate dielectric layer 701 to cover a bottom portion and aside wall of the first trench 501 and a bottom portion and a side wallof the second trench 601, as shown in FIG. 7. Preferably, the gatedielectric layer 701 may include a high K dielectric layer with high Kdielectric materials such as hafnium oxide, tantalum oxide, aluminumoxide, zirconium oxide, or titanium oxide. Preferably, before depositingthe gate dielectric layer 701, an interface layer (Interface Layer, IL),such as a thermal oxide layer, at the bottom portion of the first trench501 and/or the bottom portion of the second trench 601 may further beformed to improve interface properties between the gate dielectric layer701 and the bottom surfaces of the first trench 501 and/or the secondtrench 502, thereby improving reliability of the gate dielectric layer701.

Some devices, such as an I/O device, may need a gate dielectric layerthicker than a core device. Therefore, in some implementations,preferably, before depositing the gate dielectric layer 701, a gateoxide layer may further be formed at the bottom portion of the firsttrench 501, where the gate oxide layer and the gate dielectric layer 701which is subsequently deposited together are used as a gate dielectriclayer of a first device (for example, an I/O device). For example, thein-situ steam generation (in-situ steam generation, ISSG) process may beused to form the gate oxide layer at the bottom portion of the firsttrench 501.

Subsequently, a gate material 801, for example, tungsten or othermetallic materials, may be deposited on the gate dielectric layer 701,as shown in FIG. 8. In some implementations, a TiN cap layer may befirst deposited on the gate dielectric layer 701, and then the gatematerial 801 is deposited on the TiN cap layer.

Subsequently, a planarization process such as chemical-mechanicalpolishing (CMP) may be performed until an interlayer dielectric layer209 is exposed to form a first gate structure and a second gatestructure, as shown in FIG. 9. Herein, the first gate structure includesa first gate dielectric layer 701A at a bottom portion and a side wallof the first trench 501, and a first gate electrode 801A on the firstgate dielectric layer 701A. The second gate structure includes a secondgate dielectric layer 701B at a bottom portion and a side wall of thesecond trench 502, and a second gate electrode 801B on the second gatedielectric layer 701B.

Correspondingly, the present disclosure further provides anothersemiconductor device, with reference to FIG. 9. Compared with thesemiconductor device shown in FIG. 6, the semiconductor device shown inFIG. 9 may further include a first gate structure and a second gatestructure. Reference may be made to the foregoing description forspecific structures of the first gate structure and the second gatestructure, and details are not described herein again.

In addition, as shown in FIG. 9, in a case in which the first deviceregion 201 includes a first semiconductor fin 221 and the second deviceregion 202 includes a second semiconductor fin 222, the first dummy gatestructure may span over the first semiconductor fin 221, and the seconddummy gate structure may span over the second semiconductor fin 222. Inaddition, in some implementations, the first gate structure may furtherinclude a gate oxide layer between the bottom portion of the firsttrench 501 and the first gate dielectric layer 701A.

In some implementations, the semiconductor device may further include aninterface layer between the bottom portion of the first trench 501 andthe first gate dielectric layer 701A, and between the bottom portion ofthe second trench 601 and the second gate dielectric layer 701B.

FIG. 10A to FIG. 10J show schematic sectional drawings of various phasesfor forming a substrate structure shown in FIG. 2. Detailed descriptionis made in the following with reference to FIG. 10A to FIG. 10J.

First, an initial substrate is provided. The initial substrate is etchedto form the first device region and the second device region.

For example, as shown in FIG. 10A, a patterned hard mask 1002 may beformed on an initial substrate 1001. The initial substrate 1001 may be,for example, a semiconductor made of silicon (Si), germanium (Ge), orother elements, or may also be a semiconductor made of chemicalcompounds such as gallium arsenide (GaAs). A hard mask 1002 may be, forexample, a nitride of silicon, an oxide of silicon, or a nitrogen oxideof silicon. However, the present disclosure is not limited thereto.

Following this, as shown in FIG. 10B, the initial substrate 1001 isetched using the hard mask as a mask to form a substrate having a firstdevice region 201 and a second device region 202. The first deviceregion 201 includes a first semiconductor region 211 and a firstsemiconductor fin 221 at the first semiconductor region 211. The seconddevice region 202 includes a second semiconductor region 212 and asecond semiconductor fin 222 at the second semiconductor region 212.

Subsequently, an isolation region is formed between varioussemiconductor fins, where a top surface of the isolation region is lowerthan a top surface of each semiconductor fin.

For example, as shown in FIG. 10C, an isolation material 1003 (forexample, a dielectric material) may be deposited to fill up spacebetween the various semiconductor fins and to cover the hard mask 1002.For example, the isolation material 1003 may be deposited using, forexample, technologies such as chemical vapor deposition (CVD) offlowable chemical vapour deposition (Flowable Chemical VapourDeposition, FCVD). Optionally, before the isolation material 1003 isdeposited, a liner layer may further be formed at a surface of thesubstrate (that is, the first device region 201 and the second deviceregion 202) (for example, forming a silicon oxide layer through thermaloxidation, not shown in the figures). The liner layer may repair surfacedamages caused to the first semiconductor fin 221 and the secondsemiconductor fin 222 when etching the initial substrate 1001. After theisolation material 1003 is deposited, planarization, for example,chemical-mechanical polishing, may further be performed to the isolationmaterial 1003.

Following this, for example, as shown in FIG. 10D, the isolationmaterial 1003 is etched back so that a height of the remaining isolationmaterial 1003 reaches to an expected height, and the hard mask 1002 isexposed. Herein, the remaining isolation material 1003 after the etchingback is an isolation region 206. A top surface of the isolation region206 is lower than top surfaces of the first semiconductor fin 221 andthe second semiconductor fin 222. Subsequently, for example, as shown inFIG. 10E, the hard mask 1002 is removed. For example, the hard mask 1002may be removed using dry etching.

Optionally, ion implantation adjustment may be performed throughthreshold voltage (Vt). For example, a sacrificial oxide layer may beformed at surfaces of portions of the various semiconductor fins thatare located above the isolation region, then the ion implantationadjustment is performed through threshold voltage, and then thesacrificial oxide layer is removed.

Subsequently, dummy gate dielectric layers are formed at surfaces ofportions of the various semiconductor fins that are located above theisolation region.

As shown in FIG. 10F, a dummy gate dielectric layer 1004, such as asilicon oxide layer, is formed at surfaces of portions of the firstsemiconductor fin 221 and the second semiconductor fin 222 that arelocated above the isolation region 206.

Subsequently, a dummy gate material is deposited, and the dummy gatematerial is patterned, so as to form a first dummy gate and a seconddummy gate.

As shown in FIG. 10G, the dummy gate material, such as polysilicon, isdeposited. Then, the dummy gate material is patterned. For example, apatterned hard mask is formed on the dummy gate material. Followingthis, the dummy gate material is etched using the hard mask as a maskand the dummy gate dielectric layer as a etch stop layer to form a firstdummy gate 223 and a second dummy gate 224.

Subsequently, a first spacer layer 233, such as a nitride of silicon, isformed at a side wall of the first dummy gate 223. Moreover, a secondspacer layer 234, such as a nitride of silicon, is formed at a side wallof the second dummy gate 224, as shown in FIG. 10H. For example, siliconnitride layers may be deposited at the structure shown in FIG. 10G, andthen the deposited silicon nitride layers are etched. A silicon nitridelayer at a side wall of the first dummy gate 223 remains as the firstspacer layer 233, and a silicon nitride layer at a side wall of thesecond dummy gate 224 remains as the second spacer layer 234.

Subsequently, LDD injection is performed using the first spacer layer233 as a mask, so as to form an LDD region 205, as shown in FIG. 10I.Subsequently, a portion of the first semiconductor fin 221 that is notcovered by the first dummy gate structure 203 (including the dummy gatedielectric layer 1004 at a surface of the first semiconductor fin 221)is etched to form a recess. Then, a semiconductor material isepitaxially grown in the recess, thereby forming a raised firstsource/drain region 207.

Similarly, a part of the second semiconductor fin 222 that is notcovered by the second gate structure 204 (including the dummy gatedielectric layer 1004 at a surface of the second semiconductor fin 222)is etched to form a recess. Then, a semiconductor material isepitaxially grown in the recess, thereby forming a raised secondsource/drain region 208. The remaining dummy gate dielectric layer whichis on the first semiconductor fin 221 is used as the first dummy gatedielectric layer 213, and remaining dummy gate dielectric layer which ison the second semiconductor fin 222 is used as the second dummy gatedielectric layer 214.

Subsequently, an interlayer dielectric layer 209, for example, boronphosphate silicate glass, is deposited on the structure shown in FIG.10I (also called as a first structure). Then, the interlayer dielectriclayer 209 is planarized, to expose the first dummy gate 223 and thesecond dummy gate 224, as shown in FIG. 10J. In other implementations,first, a contact etch stop layer (CESL) (not shown in the figures) maybe deposited on the first structure shown in FIG. 10I, and then, theinterlayer dielectric layer 209 is deposited on the CESL to applyexpected stress to a device.

As mentioned above, the substrate structure shown in FIG. 2 is formed.Subsequent step 102 to step 110 may be executed according to the mannergiven above.

FIG. 11 is a simplified flowchart of a method for manufacturing asemiconductor device according to another embodiment of the presentdisclosure. As shown in FIG. 11, the method includes the followingsteps:

Step 1102, provide a substrate structure. The substrate structureincludes: a substrate, for example, a semiconductor substrate made ofsilicon; a dummy gate structure on the substrate; and a Lightly DopedDrain (LDD) region below the dummy gate structure. The dummy gatestructure includes a dummy gate dielectric layer (such as an oxide ofsilicon) on the substrate, a dummy gate (such as polysilicon) on thedummy gate dielectric layer, and a spacer layer (such as a nitride ofsilicon) at a side wall of the dummy gate. In some implementations, thesubstrate may include a semiconductor region and a semiconductor fin atthe semiconductor region, and the dummy gate structure spans over thesemiconductor fin.

Step 1104, remove the dummy gate, so as to expose the spacer layer.

Step 1106, etch back the spacer layer, so as to reduce a thickness ofthe spacer layer.

Step 1108, remove exposed dummy gate dielectric layer, so as to form atrench. It should be understood that when removing the exposed dummygate dielectric layer, a part of the dummy gate dielectric layer whichis located below the spacer layer may also be removed.

In this implementation, a thickness of the spacer layer is reduced byetching it back after the dummy gate is removed, so that in a case inwhich thermal budget is not added, an overlapping area of a channelregion and an LDD region of a device after a gate electrode issubsequently formed may be increased, so as to improve reliability ofthe device.

In some implementations, a gate structure may be formed in the formedchannel.

Above, a semiconductor device and a manufacturing method thereforaccording to the implementations of the present disclosure are describedin detail. In describing the present disclosure, some details generallyknown in the art are not described. According to the foregoingdescription, a person skilled in the art may completely understand howto implement the technical solutions disclosed herein. In addition, theembodiments and implementations according to the teaching disclosed inthe specification may be freely combined. A person skilled in the artshould understand that various amendments may be made to the embodimentsand implementations described above without departing from the spiritand scope of the present disclosure that are defined by the appendedclaims.

What is claimed is:
 1. A method for manufacturing a semiconductordevice, comprising: providing a substrate structure, wherein thesubstrate structure comprises: a substrate having a first device regionand a second device region, a first dummy gate structure at the firstdevice region, a second dummy gate structure at the second deviceregion, and a Lightly Doped Drain (LDD) region below the first dummygate structure, wherein the first dummy gate structure comprises: afirst dummy gate dielectric layer at the first device region, a firstdummy gate on the first dummy gate dielectric layer, and a first spacerlayer at a side wall of the first dummy gate, and wherein the seconddummy gate structure comprises: a second dummy gate dielectric layer atthe second device region, a second dummy gate on the second dummy gatedielectric layer, and a second spacer layer at a side wall of the seconddummy gate; removing the first dummy gate; etching back the first spacerlayer to reduce a thickness of the first spacer layer such that thethickness of the first spacer layer is smaller than a thickness of thesecond spacer layer; removing an exposed portion of the first dummy gatedielectric layer to form a first trench; removing the second dummy gateafter removing the first dummy gate; removing an exposed portion of thesecond dummy gate dielectric layer to form a second trench; depositing agate dielectric layer to cover a bottom portion and a side wall of thefirst trench and a bottom portion and a side wall of the second trench;and before depositing the gate dielectric layer, forming a gate oxidelayer only at the bottom portion of the first trench.
 2. The methodaccording to claim 1, further comprising: depositing a gate material onthe gate dielectric layer.
 3. The method according to claim 2, furthercomprising: before depositing the gate dielectric layer, forming aninterface layer at the bottom portion of the first trench and the bottomportion of the second trench.
 4. The method according to claim 1,wherein the first device region comprises an input/output (I/O) deviceregion, and the second device region comprises a core device region. 5.The method according to claim 1, wherein the first device regioncomprises a first semiconductor region and a first semiconductor fin atthe first semiconductor region; and the second device region comprises asecond semiconductor region and a second semiconductor fin at the secondsemiconductor region, wherein the first dummy gate structure spans overthe first semiconductor fin and the second dummy gate structure spansover the second semiconductor fin.
 6. The method according to claim 5,wherein steps of providing the substrate structure comprise: providingan initial substrate; etching the initial substrate to form the firstdevice region and the second device region; forming an isolation regionbetween one or more semiconductor fins, wherein a top surface of theisolation region is lower than a top surface of each semiconductor fin;forming dummy gate dielectric layers at surfaces of portions of the oneor more semiconductor fins that are located above the isolation region;depositing a dummy gate material and patterning the dummy gate materialto form the first dummy gate and the second dummy gate; forming thefirst spacer layer at a side wall of the first dummy gate, and formingthe second spacer layer at a side wall of the second dummy gate;performing LDD injection by using the first spacer layer as a mask toform the LDD region, so as to form a first structure; depositing aninterlayer dielectric layer on the first structure; and planarizing theinterlayer dielectric layer to expose the first dummy gate and thesecond dummy gate.
 7. The method according to claim 6, whereindepositing the interlayer dielectric layer on the first structurecomprises: depositing a contact etch stop layer on the first structure;and depositing the interlayer dielectric layer on the contact etch stoplayer.